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Proceedings Paper

New test structure for measuring thermal conductivity of polysilicon thin films
Author(s): Gaobin Xu; Qing-An Huang; Yanfeng Jiang
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Paper Abstract

This paper introduces a new test structure for thermal conductivity of poly-silicon thin films, and analyzes the feature ofthe measurement structure, modeling and measurement methods. The structure was fabricated by using surface micromachining process for vacuum encapsulation fabrication, while post- processing bulk silicon micromachining is not essential.

Paper Details

Date Published: 10 September 2002
PDF: 5 pages
Proc. SPIE 4928, MEMS/MOEMS Technologies and Applications, (10 September 2002); doi: 10.1117/12.483184
Show Author Affiliations
Gaobin Xu, Southeast Univ. (China)
Qing-An Huang, Southeast Univ. (China)
Yanfeng Jiang, Southeast Univ. (China)


Published in SPIE Proceedings Vol. 4928:
MEMS/MOEMS Technologies and Applications
Guofan Jin; John S. McKillop; Kazuhiro Hane, Editor(s)

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