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Proceedings Paper

Microstructures of PMMA sheet fabricated by RIE
Author(s): Longwang Huang; Chunsheng Yang; Guifu Ding
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Paper Abstract

The reactive ion etching (RIE) of commercial PMMA sheet has been examined in pure 02 and CHF3/02 plasma. The aim of this study was to optimize the etching PMMA process parameter. Addition of CHF3 , which have a surface passivation effect, to Oxygen plasmas should be obtained vertical edges at an acceptable etch rate. A RIE parallel plate reactor was used and electroplated nickel film was used as mask. We discuss the influence of pure 02 and O2/CHF3 etching gas on etching profile, the influence of the etching parameters such as gas pressure and CHF3/O2 ratio on vertical etching rate, lateral etching rate and etching profile was also investigated.

Paper Details

Date Published: 10 September 2002
PDF: 6 pages
Proc. SPIE 4928, MEMS/MOEMS Technologies and Applications, (10 September 2002); doi: 10.1117/12.483173
Show Author Affiliations
Longwang Huang, Shanghai Jiaotong Univ. (China)
Chunsheng Yang, Shanghai Jiaotong Univ. (China)
Guifu Ding, Shanghai Jiaotong Univ. (China)


Published in SPIE Proceedings Vol. 4928:
MEMS/MOEMS Technologies and Applications
Guofan Jin; John S. McKillop; Kazuhiro Hane, Editor(s)

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