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Proceedings Paper

Wafer lever packaging for gyroscope by Au/Si eutectic bonding
Author(s): Yong Ruan; Dacheng Zhang; Zhenchuan Yang; Xiang Wang; Xiaomei Yu
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Paper Abstract

This paper will focus on Au/Si eutectic bonding technology. We have set up and improved some MEMS models concerning this technique for discussion. Annealing temperature on bonding was also taken into consideration. Since hydrophilic surface has a large number of —OH groups, which can make two wafers in contact, we derive a hydrophilic surface from dipping the wafer in H2O /H202/NH4OH solution. Especially we use MEMS models with ANSYS to simulate and guide the fabrication of MEMS device. Furthermore, we have improved MEMS structure. Because its bonding temperature, voltage and pressure are low, by using the following technique we could get high density and more reliable MEMS device. We also have used this technology to fabricate gyroscope and some other MEMS devices. Classical Au/Si fusion bonding at 1000°C, and anodic at 450°C is not a commercially feasible process. We achieved AU/Si eutectic bonding technology for gyroscope and other MEMS device manufacture.

Paper Details

Date Published: 10 September 2002
PDF: 5 pages
Proc. SPIE 4928, MEMS/MOEMS Technologies and Applications, (10 September 2002); doi: 10.1117/12.483165
Show Author Affiliations
Yong Ruan, Peking Univ. (China)
Dacheng Zhang, Peking Univ. (China)
Zhenchuan Yang, Peking Univ. (China)
Xiang Wang, Peking Univ. (China)
Xiaomei Yu, Peking Univ. (China)

Published in SPIE Proceedings Vol. 4928:
MEMS/MOEMS Technologies and Applications
Guofan Jin; John S. McKillop; Kazuhiro Hane, Editor(s)

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