Share Email Print

Proceedings Paper

Wafer lever packaging for gyroscope by Au/Si eutectic bonding
Author(s): Yong Ruan; Dacheng Zhang; Zhenchuan Yang; Xiang Wang; Xiaomei Yu
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Details

Date Published: 10 September 2002
PDF: 5 pages
Proc. SPIE 4928, MEMS/MOEMS Technologies and Applications, (10 September 2002); doi: 10.1117/12.483165
Show Author Affiliations
Yong Ruan, Peking Univ. (China)
Dacheng Zhang, Peking Univ. (China)
Zhenchuan Yang, Peking Univ. (China)
Xiang Wang, Peking Univ. (China)
Xiaomei Yu, Peking Univ. (China)

Published in SPIE Proceedings Vol. 4928:
MEMS/MOEMS Technologies and Applications
Guofan Jin; John S. McKillop; Kazuhiro Hane, Editor(s)

© SPIE. Terms of Use
Back to Top