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Proceedings Paper

Finite element simulation of laser spallation technique
Author(s): Ming Zhou; Jianping Kan; Lan Cai; Yongkang Zhang; J. Z. Zhou; Zhonghua Shen; X. R. Zhang; Shu-yi Zhang
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Paper Abstract

Finite element simulation of measuring the film-matrix interface strength was the most concern of this paper. Instead of in previously reported measurements the experimentally measured free surface velocity, enegry and pessure of laser pulse in the present article allowed definition of the loading conditions in the numerical model. On the basis of theory for laser hypervelocity impact dynamics, experiment was predigested into two relative but non-coupling processes, transient thermal analysis and transient dynamics analysis. In the former, the procedure employed for the solution of thermal equation was the generalized trapezoidal rule. In the latter, the Crank-Nicholson difference time integration method was employed for the solution of wave equation. Based on the experiments, a model for laser-induced film spallation was proposed to study the propagation of stress wave and to evaluate the spall resistance of sputtered films. The analyzed result showed the dynamic adhesive strength of the TiN coating on the 304 stainless steel substrates is 183.64Mpa. It is theoretically proved that the interface stress triggering the film pry-offs was not single superimposition of pressure pulse and reflected tensile pulse, but multi-superimposition of pressure and tensile pulses.

Paper Details

Date Published: 12 September 2002
PDF: 6 pages
Proc. SPIE 4915, Lasers in Material Processing and Manufacturing, (12 September 2002); doi: 10.1117/12.482907
Show Author Affiliations
Ming Zhou, Jiangsu Univ. (China)
Jianping Kan, Jiangsu Univ. (China)
Lan Cai, Jiangsu Univ. (China)
Yongkang Zhang, Jiangsu Univ. (China)
J. Z. Zhou, Jiangsu Univ. (China)
Zhonghua Shen, Nanjing Univ. (China)
X. R. Zhang, Nanjing Univ. (China)
Shu-yi Zhang, Nanjing Univ. (China)


Published in SPIE Proceedings Vol. 4915:
Lasers in Material Processing and Manufacturing
ShuShen Deng; Tatsuo Okada; Klaus Behler; XingZong Wang, Editor(s)

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