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Proceedings Paper

Microvia formation with lasers
Author(s): Yunlong Sun; Corey M. Dunsky; Hisashi Matsumoto; Glenn Simenson
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Paper Abstract

Laser drilling has emerged in the last five years as the most widely accepted method of creating microvias in high-density electronic interconnect and chip packaging devices. Most commercially available laser drilling tools are currently based on one of two laser types: far-IR CO2 lasers and UV solid-state lasers at 355 nm. While CO2 lasers are recognized for their high average power and drilling throughput, UV lasers are known for high precision material removal and their ability to drill the smallest vias, with diameters down to about 25 -30 micron now achievable in production. This paper presents an overview of techniques for drilling microvias with the lasers.

Paper Details

Date Published: 12 September 2002
PDF: 12 pages
Proc. SPIE 4915, Lasers in Material Processing and Manufacturing, (12 September 2002); doi: 10.1117/12.482893
Show Author Affiliations
Yunlong Sun, Electro Scientific Industries, Inc. (United States)
Corey M. Dunsky, Electro Scientific Industries, Inc. (United States)
Hisashi Matsumoto, Electro Scientific Industries, Inc. (United States)
Glenn Simenson, Electro Scientific Industries, Inc. (United States)


Published in SPIE Proceedings Vol. 4915:
Lasers in Material Processing and Manufacturing
ShuShen Deng; Tatsuo Okada; Klaus Behler; XingZong Wang, Editor(s)

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