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Proceedings Paper

Three-dimensional microwave imaging technology for damage detection of concrete structures
Author(s): Yoo Jin Kim; Luis Jofre; Franco De Flaviis; Maria Qing Feng
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Paper Abstract

Various nondestructive evaluation (NDE) techniques have been studied to locate steel rebars or dowel, and to detect invisible damage such as voids and cracks inside concrete and debonding between rebars and concrete caused by corrosions and earthquakes. In this study, the authors developed 3-dimensional (3D) electromagnetic (EM) imaging technology to detect such damage and to identify exact location of steel rebars or dowel. The authors have developed sub-surface two-dimensional (2D) imaging technique using tomographic antenna array in previous works. In this study, extending the earlier analytical and experimental works on 2D image reconstruction, a 3D microwave imaging system using tomographic antenna array was developed, and multi-frequency technique was applied to improve quality of the reconstructed image and to reduce background noises. This paper presents the analytical expressions of numerical focusing procedures for 3D image reconstruction and numerical simulation to study the resolution of the system and the effectiveness of multi-frequency technique. Also, the design of 4x4 antenna array with switching devices is introduced as a preliminary study for the final design of whole array.

Paper Details

Date Published: 18 August 2003
PDF: 8 pages
Proc. SPIE 5057, Smart Structures and Materials 2003: Smart Systems and Nondestructive Evaluation for Civil Infrastructures, (18 August 2003); doi: 10.1117/12.482396
Show Author Affiliations
Yoo Jin Kim, Univ. of California, Irvine (United States)
Luis Jofre, Univ. Politecnica de Catalunya (Spain)
Franco De Flaviis, Univ. of California, Irvine (United States)
Maria Qing Feng, Univ. of California, Irvine (United States)

Published in SPIE Proceedings Vol. 5057:
Smart Structures and Materials 2003: Smart Systems and Nondestructive Evaluation for Civil Infrastructures
Shih-Chi Liu, Editor(s)

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