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Proceedings Paper

Experiments in ultrasonic flaw detection using a MEMS transducer
Author(s): Akash Jain; David W. Greve; Irving J. Oppenheim
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Paper Abstract

In earlier work we developed a MEMS phased array transducer, fabricated in the MUMPs process, and we reported on initial experimental studies in which the device was affixed into contact with solids. We demonstrated the successful detection of signals from a conventional ultrasonic source, and the successful localization of the source in an off-axis geometry using phased array signal processing. We now describe the predicted transmission and coupling characteristics for such devices in contact with solids, demonstrating reasonable agreement with experimental behavior. We then describe the results of flaw detection experiments, as well as results for fluid-coupled detectors.

Paper Details

Date Published: 18 August 2003
PDF: 9 pages
Proc. SPIE 5057, Smart Structures and Materials 2003: Smart Systems and Nondestructive Evaluation for Civil Infrastructures, (18 August 2003); doi: 10.1117/12.482382
Show Author Affiliations
Akash Jain, Carnegie Mellon Univ. (United States)
David W. Greve, Carnegie Mellon Univ. (United States)
Irving J. Oppenheim, Carnegie Mellon Univ. (United States)


Published in SPIE Proceedings Vol. 5057:
Smart Structures and Materials 2003: Smart Systems and Nondestructive Evaluation for Civil Infrastructures
Shih-Chi Liu, Editor(s)

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