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Proceedings Paper

Optical-I/O packaging technologies for chip- and board-level optical interconnects
Author(s): Yuzo Ishii
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Paper Details

Date Published: 3 September 2002
PDF: 8 pages
Proc. SPIE 4907, Optical Switching and Optical Interconnection II, (3 September 2002); doi: 10.1117/12.482271
Show Author Affiliations
Yuzo Ishii, NTT Corp. (Japan)


Published in SPIE Proceedings Vol. 4907:
Optical Switching and Optical Interconnection II
Lih-Yuan Lin; Yimo Zhang; Kimio Oguchi, Editor(s)

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