Share Email Print

Proceedings Paper

Evaluation of new UV-cured adhesives and effects of post-cure UV exposure
Author(s): John G. Daly
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Recent developments in adhesives have yielded products well suited for optical applications. Ultraviolet light-cured adhesives can be cured in seconds and are an attractive candidate. Selection of the adhesive properties can be made to achieve optimum performance. For improved alignment stability and reduced stress, low shrinkage adhesives have been needed. New UV-cured adhesives are evaluated with shrinkage values of less than 0.2%. In addition to controlled bonding for alignment stability, the effects of post-cure UV laser exposure (266 nm) are evaluated. Adhesives needed for systems employing UV lasers must consider off-axis exposure that can cause photo-reactive degradation. Relatively low power laser exposure is used as a simulated source for off-axis or scattered irradiation. None of these candidate adhesives are intended for in-the-light path use at 266 nm, but rather as structural adhesives. Evaluation of these candidates included a outgassing screening test that may be employed to select materials.

Paper Details

Date Published: 9 September 2002
PDF: 7 pages
Proc. SPIE 4771, Optomechanical Design and Engineering 2002, (9 September 2002); doi: 10.1117/12.482172
Show Author Affiliations
John G. Daly, Vector Engineering, Inc. (United States)

Published in SPIE Proceedings Vol. 4771:
Optomechanical Design and Engineering 2002
Alson E. Hatheway, Editor(s)

© SPIE. Terms of Use
Back to Top