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Proceedings Paper

New methods to directly measure adhesive stress and movement on glass
Author(s): David C. Watts; A. S. Marouf; Detlef Heindl
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Paper Abstract

Practical scientific methods have been devised to measure cure-shrinkage phenomena for a small-volume disk geometry of adhesive agents, in liquid or paste form. These can be conducted simply, reproducibly and quickly, typically 5-120 min, once the apparati are set up. Originally utilised to measure shrinkage behavior in photocuring dental adhesives and biomaterials, the measurements may be applied as well to adhesives for fiber optic and optical applications. They are especially suitable for UV and visible-light curing adhesives. The 'bonded-disk' method is used for the measurement of shrinkage-strain kinetics and the Bioman method for shrinkage-stress of adhesives.

Paper Details

Date Published: 9 September 2002
PDF: 12 pages
Proc. SPIE 4771, Optomechanical Design and Engineering 2002, (9 September 2002); doi: 10.1117/12.482165
Show Author Affiliations
David C. Watts, Univ. of Manchester (United Kingdom)
A. S. Marouf, Univ. of Manchester and Tishreen Univ. (United Kingdom)
Detlef Heindl, Dymax Europe GmbH (Germany)


Published in SPIE Proceedings Vol. 4771:
Optomechanical Design and Engineering 2002
Alson E. Hatheway, Editor(s)

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