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Proceedings Paper

Femtosecond laser drilling of high-aspect-ratio 1-micron holes in silicon
Author(s): Dennis R. Alexander; B. Mihulka; David W. Doerr
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Paper Abstract

There is a need in many scientific and manufacturing processes to drill to small diameter holes with high aspect ratios in both brittle materials as well as metals. Femtosecond lasers operating at 795 nm or frequency doubled to 400 nm provide a unique tool for carrying out these processes. In this work, the femtosecond laser nanomachining facilities at the University of Nebraska is discussed to drill 1 micrometers holes in Si/SiO2 with aspect rations > 8. The quality of the cut and the small nanoparticles are discussed.

Paper Details

Date Published: 13 September 2002
PDF: 11 pages
Proc. SPIE 4760, High-Power Laser Ablation IV, (13 September 2002); doi: 10.1117/12.482107
Show Author Affiliations
Dennis R. Alexander, Univ. of Nebraska/Lincoln (United States)
B. Mihulka, Univ. of Nebraska/Lincoln (United States)
David W. Doerr, Univ. of Nebraska/Lincoln (United States)

Published in SPIE Proceedings Vol. 4760:
High-Power Laser Ablation IV
Claude R. Phipps, Editor(s)

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