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Proceedings Paper

Processing of semiconductors with femtosecond lasers
Author(s): Hans Kurt Toenshoff; Andreas Ostendorf; Niko Baersch
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Paper Abstract

Semiconductor materials are still the material of choice also in many microsystems applications. This is mainly justified by the availability of mature processes and equipment originally developed for microelectronics fabrication. However, for microsystems more flexible requirements have to be fulfilled and new tools have to be developed especially with regard to smaller part numbers than in microelectronics. But also in microelectronics, conventional machines have often reached their limits in semiconductor processing which leads to the requirement of new processes. Lasers are generally able to ablate semiconductor materials. Especially ultrafast lasers are able to perform processes with high efficiency and accuracy. One of the most challenging conditions is not to influence the bulk material. Within this paper, the general interaction of ultrafast lasers with semiconductors is investigated. The ablation process is outlined and beam parameters influencing the removal and especially the cutting process are described, and potential applications are shown.

Paper Details

Date Published: 13 September 2002
PDF: 9 pages
Proc. SPIE 4760, High-Power Laser Ablation IV, (13 September 2002); doi: 10.1117/12.482102
Show Author Affiliations
Hans Kurt Toenshoff, Laser Zentrum Hannover e.V. (Germany)
Andreas Ostendorf, Laser Zentrum Hannover e.V. (Germany)
Niko Baersch, Laser Zentrum Hannover e.V. (Germany)

Published in SPIE Proceedings Vol. 4760:
High-Power Laser Ablation IV
Claude R. Phipps, Editor(s)

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