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Proceedings Paper

Fundamentals and advantages in ultrafast micro-structuring of transparent materials
Author(s): David Ashkenasi; Arkadi Rosenfeld; Razvan Stoian; Nadezhda M. Bulgakova; Eleanor E. B. Campbell; Ingolf V. Hertel
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Paper Abstract

Time resolved studies using femtosecond laser pulses at 800 nm illuminate the distinctions in the dynamics of ultrafast processing of dielectrics compared to semi-conductors and metals. Dielectric materials are strongly charged at the surface on the sub-ps time scale and undergo an impulsive Coulomb explosion prior to thermal ablation. Provided the laser pulse width remains in the ps or sub-ps time domain this effect can be exploited for processing. Otherwise, the high localization of energy accompanied by ultrafast laser micro structuring is of great advantage also for high quality processing of thin metallic or semi-conductive layers, where the surface charge is effectively quenched.

Paper Details

Date Published: 13 September 2002
PDF: 7 pages
Proc. SPIE 4760, High-Power Laser Ablation IV, (13 September 2002); doi: 10.1117/12.482033
Show Author Affiliations
David Ashkenasi, Laser- und Medizin-Technologie GmbH (Germany)
Arkadi Rosenfeld, Max-Born-Institut fuer Nichtlineare Optik und Kurzzeitspektroskopie (Germany)
Razvan Stoian, Max-Born-Institut fuer Nichtlineare Optik und Kurzzeitspektroskopie (Germany)
Nadezhda M. Bulgakova, Institute of Thermophysics (Russia)
Eleanor E. B. Campbell, Goeteborg Univ. (Sweden) and Chalmers Univ. of Technology (Sweden)
Ingolf V. Hertel, Max-Born Institute fuer Nichtlineare Optik und Kurzzeitspektroskopie (Germany)


Published in SPIE Proceedings Vol. 4760:
High-Power Laser Ablation IV
Claude R. Phipps, Editor(s)

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