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Proceedings Paper

300-W XeCl excimer laser annealing techniques in low-temperature polysilicon technology
Author(s): Burkhard Fechner; Ulrich Rebhan; Rustem Osmanov; Mark Schiwek; Hans-Juergen Kahlert
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Paper Abstract

The most recent development in industrial fabrication processes of low temperature poly-silicon by means of excimer laser and optics system is presented: . The recently developed high performance excimer laser, which delivers the highest output power currently commercially available in combination with two different beam shaping methods, the commonly known ELA-technique and the new SLS-technique for enhanced Field effect mobiliiy in the LTPS, is demonstrated.

Paper Details

Date Published: 5 September 2002
PDF: 4 pages
Proc. SPIE 4914, High-Power Lasers and Applications II, (5 September 2002); doi: 10.1117/12.481801
Show Author Affiliations
Burkhard Fechner, Lambda Physik Japan Co., Ltd. (Japan)
Ulrich Rebhan, Lambda Physik AG (Germany)
Rustem Osmanov, Lambda Physik AG (Germany)
Mark Schiwek, Lambda Physik AG (Germany)
Hans-Juergen Kahlert, MicroLas Lasersystem GmbH (Germany)

Published in SPIE Proceedings Vol. 4914:
High-Power Lasers and Applications II
Dianyuan Fan; Keith A. Truesdell; Koji Yasui, Editor(s)

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