Share Email Print
cover

Proceedings Paper

Adhesive curing options for photonic packaging
Author(s): Steven C. Martin; Manfred Hubert; Robin Tam
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Varying the intensity of illumination used to cure photoactivated adhesives has been applied in medical and dental applications to improve the performance of polymer materials. For example, it has been observed that dental polymer composite materials express reduced shrinkage, important for durability of non-amalgam restorations, by introducing a phased time-intensity cure schedule. This work identified that curing conditions could influence the final properties of materials, and suggested the possibility of extending the characteristics that could be influenced beyond shrinkage to humidity resistance, Tg, outgassing and other important material properties. Obviously, these results have important ramifications for the photonic industry, with current efforts focused on improved manufacturing techniques. Improvement in low cost packaging solutions, including adhesives, will have to be made to bring the component cost down to address the needs of Metro and similar markets. However, there are perceived problems with the widespread use of adhesives, the most prevalent of these involving long term durability of the bond. Devices are typically aligned to sub-micron precision using active feedback and then must be locked in position to maintain performance. In contrast to traditional fastening methods, adhesive bonding is a highly attractive option due to the ease of deployment, lower equipment costs, and improved flexibility. Moreover, using methods analogous to those employed in dental applications, materials properties of photonic adhesives may be tailored using a programmed cure approach.

Paper Details

Date Published: 25 June 2002
PDF: 5 pages
Proc. SPIE 4639, Optical Fiber and Fiber Component Mechanical Reliability and Testing II, (25 June 2002); doi: 10.1117/12.481334
Show Author Affiliations
Steven C. Martin, EFOS Inc. (Canada)
Manfred Hubert, EFOS Inc. (Canada)
Robin Tam, BTI Photonics Inc. (Canada)


Published in SPIE Proceedings Vol. 4639:
Optical Fiber and Fiber Component Mechanical Reliability and Testing II
M. John Matthewson; Charles R. Kurkjian, Editor(s)

© SPIE. Terms of Use
Back to Top