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Proceedings Paper

Modeling connector degradation
Author(s): Michael J. LuValle; Gair D. Brown; Bruce G. LeFevre; Robert Throm
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Paper Abstract

In this report we analyze experimental data on the degradation of connectors that are undergoing temperature humidity cycling. The data produced to date give a strong indication that connector degradation under the high stress conditions used to date is consistent with a mechanism driven by multiple distributions of flaws in the epoxy bonds. The current model and statistical evidence are discussed, and related to some theoretical work done previously. In addition, some suggestions for further experiments are made to explore the acceleration dynamics of the mechanism.

Paper Details

Date Published: 25 June 2002
PDF: 9 pages
Proc. SPIE 4639, Optical Fiber and Fiber Component Mechanical Reliability and Testing II, (25 June 2002); doi: 10.1117/12.481332
Show Author Affiliations
Michael J. LuValle, OFS-Fitel (United States)
Gair D. Brown, Naval Surface Warfare Ctr. (United States)
Bruce G. LeFevre, OFS-Fitel (United States)
Robert Throm, Naval Surface Warfare Ctr. (United States)


Published in SPIE Proceedings Vol. 4639:
Optical Fiber and Fiber Component Mechanical Reliability and Testing II
M. John Matthewson; Charles R. Kurkjian, Editor(s)

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