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Proceedings Paper

Optical packaging activities at Institute of Microelectronics (IME), Singapore
Author(s): Keng-Hwa Teo; Krishnamachari Sudharsanam; Ramana Venkata Pamidighantam; Yongkee Yeo; Mahadevan K. Iyer
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Paper Abstract

The development of optoelectronic components for gigabit Ethernet communications is converging towards access networks where the cost of device makes a significant impact on the market acceptance. Device fabrication and packaging cost have to be brought down with novel assembly and packaging methods. Singapore has established a reputation in semiconductor device development and fabrication with excellent process and packaging facilities. Institute of Microelectronics (IME) was founded in 1991 to add value to the Singapore electronics industry. IME is involved in the development of active and passive photonics components using Silicon and polymer materials. We present a brief report on the development activities taking place in the field of optical component packaging at IME in recent years. We present a review of our competence and some of the optical device packaging activities that are being undertaken.

Paper Details

Date Published: 23 August 2002
PDF: 6 pages
Proc. SPIE 4906, Optical Components and Transmission Systems, (23 August 2002); doi: 10.1117/12.480562
Show Author Affiliations
Keng-Hwa Teo, Institute of Microelectronics (Singapore)
Krishnamachari Sudharsanam, Institute of Microelectronics (Singapore)
Ramana Venkata Pamidighantam, Institute of Microelectronics (Singapore)
Yongkee Yeo, Institute of Microelectronics (Singapore)
Mahadevan K. Iyer, Institute of Microelectronics (Singapore)


Published in SPIE Proceedings Vol. 4906:
Optical Components and Transmission Systems
WeiSheng Hu; Shoichi Sudo; Peter Kaiser, Editor(s)

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