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Proceedings Paper

Fabrication of microchannels for compliant wafer-level packaging using sacrificial materials
Author(s): Hollie A. Reed; Joseph Paul Jayachandran; Robert A. Shick; Larry F. Rhodes; Jeffery Krotine; Ed Elce; Sue Ann Allen; Paul A. Kohl
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Paper Abstract

Electronic packaging and chip-to-module connections have evolved to meet the needs of electronic systems. The rate of change of the technology will accelerate as the package disappears and optical interconnects come into play. Compliant wafer-scale packaging is an approach which can be used to provide acceptable electrical and mechanical functions for future electronic packaging. In this work, buried air-cavities using sacrificial polymers are used to provide compressible input/output leads.

Paper Details

Date Published: 15 January 2003
PDF: 8 pages
Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); doi: 10.1117/12.479568
Show Author Affiliations
Hollie A. Reed, Georgia Institute of Technology (United States)
Joseph Paul Jayachandran, Georgia Institute of Technology (United States)
Robert A. Shick, Promerus LLC (United States)
Larry F. Rhodes, Promerus LLC (United States)
Jeffery Krotine, Promerus LLC (United States)
Ed Elce, Promerus LLC (United States)
Sue Ann Allen, Georgia Institute of Technology (United States)
Paul A. Kohl, Georgia Institute of Technology (United States)


Published in SPIE Proceedings Vol. 4979:
Micromachining and Microfabrication Process Technology VIII
John A. Yasaitis; Mary Ann Perez-Maher; Jean Michel Karam, Editor(s)

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