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Proceedings Paper

Applications of CMOS processing to realize functional on-chip optical interconnects for VLSI
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Paper Details

Date Published: 30 May 2003
PDF: 4 pages
Proc. SPIE 4997, Photonics Packaging and Integration III, (30 May 2003); doi: 10.1117/12.479477
Show Author Affiliations
Terry V. Clapp, Univ. of Cambridge (United Kingdom)
Laurence W. Cahill, La Trobe Univ. (Australia)


Published in SPIE Proceedings Vol. 4997:
Photonics Packaging and Integration III
Randy A. Heyler; David J. Robbins; Ghassan E. Jabbour, Editor(s)

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