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Proceedings Paper

Measuring and assessing printability of reticle pinhole defects
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Paper Abstract

Reticle pinhole defects below 200nm are problematic from several standpoints. The wafer manufacturer presents a specification to the reticle producer, who in turn charges the inspection tool vendors with the task of detecting pinholes of a given size. The measurement of these pinholes, especially on programmed defect test masks, becomes critical to the success of this flow. Measuring the size of these small pinholes using the current SEM method often produces inconsistent results when compared to pinhole printability. Early studies have suggested that since the SEM measures only the top surface of the pinhole, the measurement does not account for edge wall angle and partial filling which reduces the pinhole transmission and subsequent printability. This investigation focuses on several transmitted light approaches for reticle pinhole measurement on programmed defect masks. An attempt to correlate these methods back to traditional SEM and optical sizing methods will also be attempted.

Paper Details

Date Published: 16 August 2002
PDF: 8 pages
Proc. SPIE 4764, 18th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (16 August 2002); doi: 10.1117/12.479355
Show Author Affiliations
Darren Taylor, Photronics Inc. (United States)
Anthony Vacca, KLA-Tencor Corp. (United States)
Larry S. Zurbrick, KLA-Tencor Corp. (United States)
William H. Broadbent, KLA-Tencor Corp. (United States)
Peter Fiekowsky, AVI-Automated Visual Inspection (United States)


Published in SPIE Proceedings Vol. 4764:
18th European Conference on Mask Technology for Integrated Circuits and Microcomponents

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