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Proceedings Paper

Productivity and OPC reticle inspectability using multibeam UV wavelength inspection
Author(s): Mark R. Laurance; Dino Hsieh; Vincent Wen
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Paper Abstract

In order to extend the life of DUV lithography to the 130 nm design rule and below, optical proximity correction (OPC) and phase shift masks (PSM) have become increasingly common. The implementation of low k lithography in IC production requires inspection systems with smaller linewidth capability and higher sensitivity to obtain high yields in advanced reticle production. This paradigm presents greater inspection challenges for current UV tools. When inspections are run on advanced reticles on current tools, the number of false and nuisance defect detections are so high as to make inspecting these reticles unmanageable. The amount of desense required to bring false and nuisance detections down also causes real defects to be missed. The TeraStar SLF27 is the next generation reticle inspection tool from KLA-Tencor. The TeraStar addresses these problems with new algorithms that allow inspection of OPC features without desensing the detectors. Complementing this are triple-beam optics and the ability to run pattern and STARlight inspections concurrently giving a net gain in the throughput and productivity of the tool. Here we present the first results from the use of the TeraStar in a production environment.

Paper Details

Date Published: 16 August 2002
PDF: 4 pages
Proc. SPIE 4764, 18th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (16 August 2002); doi: 10.1117/12.479354
Show Author Affiliations
Mark R. Laurance, KLA-Tencor Corp. (United States)
Dino Hsieh, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Vincent Wen, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)


Published in SPIE Proceedings Vol. 4764:
18th European Conference on Mask Technology for Integrated Circuits and Microcomponents

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