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Proceedings Paper

Multibeam resolution die-to-database reticle inspection
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Paper Abstract

A new die-to-database reticle inspection system has been developed to meet the production requirements for 130nm node 4x reticles, as well as, the early inspection requirements for 100nm node 4x reticles. This new system is based on the TeraStar platform1 developed recently by KLA-Tencor Corporation for high performance die-to-die and STARlight inspection of 130nm node reticles. The TeraStar platform uses high-NA triple-beam scanning laser optics for high throughput. The platform also includes a new generation of defect detection algorithms and image processing hardware to inspect, with high sensitivity and low false detections, the small linewidths, aggressive OPC, and advanced EPSM 4x reticles characteristic of the 130nm node. The platform further includes the TeraPro concurrent STARlight and die- to-die inspection mode for exceptional productivity. The necessary database elements have now been developed and added to the TeraStar platform, to give it die-to-database inspection capability. A new data format along with new data preparation, data rendering, and data modeling algorithms have been developed to allow high precision database matching with the optical image for exceptional die-to- database performance. The TeraPro high productivity features of the TeraStar platform have been extended to the die-to- database mode providing the opportunity to use STARlight and die-to-database modes concurrently. The system design and in-house test results are discussed.

Paper Details

Date Published: 16 August 2002
PDF: 11 pages
Proc. SPIE 4764, 18th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (16 August 2002); doi: 10.1117/12.479351
Show Author Affiliations
William Waters Volk, KLA-Tencor Corp. (United States)
William H. Broadbent, KLA-Tencor Corp. (United States)
Hector I. Garcia, KLA-Tencor Corp. (United States)
Sterling G. Watson, KLA-Tencor Corp. (United States)
Phillip Lim, KLA-Tencor Corp. (United States)
Wayne E. Ruch, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 4764:
18th European Conference on Mask Technology for Integrated Circuits and Microcomponents

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