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Proceedings Paper

CD performance of CA-resits with dynamically controlled multi-zone bake system
Author(s): Shiho Sasaki; Masa-aki Kurihara; Hiroshi Mohri; Naoya Hayashi; Peter Dress; Andreas Noering; Thomas M. Gairing
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Paper Abstract

CD-uniformity data of chemically amplified (CA) resists have been generated, by using a dynamically controlled multi-zone hotplate system, APB5000. The optimized baking procedure of the APB5000 system for Post Coat Bake (PCB) and Post Exposure Bake (PEB) is characterized by a maximum in the total temperature range on a 6025 mask substrate surface of 0.5 degree(s)C during the heat-up ramping and smaller than 0.2 degree(s)C at the set-point temperature of 90 degree(s)C. In this experiment CD-uniformity for isolated lines was improved to 7.8nm, compared to 13nm when using conventional baking systems. Additionally, a compensation method based on the baking processes is presented to further decrease the CD- uniformity range of CA-resists. Derived from CD-uniformity data measurements, a local temperature variation from the optimized baking strategy of the APB5000 system is used to compensate CD-errors caused by other process steps. In this experiment the result of such a measure showed a 40% improvement of the CD-uniformity range for dense lines from 14.2nm to 8.0nm.

Paper Details

Date Published: 16 August 2002
PDF: 10 pages
Proc. SPIE 4764, 18th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (16 August 2002); doi: 10.1117/12.479343
Show Author Affiliations
Shiho Sasaki, Dai Nippon Printing Co., Ltd. (Japan)
Masa-aki Kurihara, Dai Nippon Printing Co., Ltd. (Japan)
Hiroshi Mohri, Dai Nippon Printing Co., Ltd. (Japan)
Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan)
Peter Dress, STEAG HamaTech AG (Germany)
Andreas Noering, STEAG HamaTech AG (Germany)
Thomas M. Gairing, STEAG HamaTech AG (Germany)


Published in SPIE Proceedings Vol. 4764:
18th European Conference on Mask Technology for Integrated Circuits and Microcomponents

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