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Proceedings Paper

Laser processing of ceramic and crystalline wafer substrates for microelectronic applications
Author(s): David Ashkenasi; Alexander Binder; Houssam Jaber; Holger Kern; Norbert Mueller; Andreas Ziegert
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Paper Abstract

Ceramic and crystalline wafer substrates are widely used in microelectronics. The individual choice is based on their thermal, optical and mechanical properties. For a variety of applications high quality laser micro processing of these materials, i.e. the generation of blind and through holes, grooves and even complex three dimensional micro structures, is gaining in importance. The department of applied laser technologies of the LMTB GmbH has conducted extensive studies on the versatility of q-switch Nd:YAG laser systems for the micro structuring of ceramic and crystalline wafer substrates that differ strongly in their optical and mechanical properties, such as Al2O3, AlN, sapphire, Si and SiC. This paper discusses the laser material micro machining results in respect to the laser parameters used to optimize the micro processing quality and speed for the different materials.

Paper Details

Date Published: 17 October 2003
PDF: 13 pages
Proc. SPIE 4977, Photon Processing in Microelectronics and Photonics II, (17 October 2003); doi: 10.1117/12.479234
Show Author Affiliations
David Ashkenasi, Laser- und Medizin-Technologie GmbH (Germany)
Alexander Binder, Laser- und Medizin-Technologie GmbH (Germany)
Houssam Jaber, Laser- und Medizin-Technologie GmbH (Germany)
Holger Kern, Laser- und Medizin-Technologie GmbH (Germany)
Norbert Mueller, Laser- und Medizin-Technologie GmbH (Germany)
Andreas Ziegert, Laser- und Medizin-Technologie GmbH (Germany)


Published in SPIE Proceedings Vol. 4977:
Photon Processing in Microelectronics and Photonics II
Alberto Piqué; Koji Sugioka; Peter R. Herman; Jim Fieret; David B. Geohegan; Frank Träger; Kouichi Murakami; Friedrich G. Bachmann; Jan J. Dubowski; Willem Hoving; Kunihiko Washio, Editor(s)

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