Share Email Print
cover

Proceedings Paper

Advanced imaging sensors at Rockwell Scientific Company
Author(s): John T. Montroy; James D. Garnett; Scott A. Cabelli; Markus Loose; Atul B. Joshi; Gary W. Hughes; Lester J. Kozlowski; Allan K. Haas; Selmer S. Wong; Majid Zandian; Annie Chi-yi Chen; John G. Pasko; Mark C. Farris; Craig A. Cabelli; Donald E. Cooper; Jose M. Arias; Jagmohan Bajaj; Kadri Vural
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The past 2 to 3 years has been a period of explosive growth in technology development for imaging sensors at Rockwell Scientific Co. (RSC). The state of the art has been advanced significantly, resulting in a number of unique advanced imaging sensor products. A few key examples are: 2048 x 2048 sensor chip assemblies (SCA) for ground and space-based applications, 4096 x 4096 mosaic close-butted mosaic FPA assemblies, a very high performance 10 x 1024 hybridized linear SCA for optical network monitoring and other applications, the revolutionary CMOS ProCam-HD imaging system-on-a-chip for high definition television (HDTV), and RSC's near-infrared emission microscope camera for VLSI defect detection/analysis. This paper provides selected updates of these products and thereby provides an overview of the ongoing highly fertile period of technology and product development at Rockwell Scientific. A view into future directions for advanced imaging sensors is also provided.

Paper Details

Date Published: 5 August 2002
PDF: 15 pages
Proc. SPIE 4721, Infrared Detectors and Focal Plane Arrays VII, (5 August 2002); doi: 10.1117/12.478849
Show Author Affiliations
John T. Montroy, Rockwell Scientific Co. L.L.C. (United States)
James D. Garnett, Rockwell Scientific Co. L.L.C. (United States)
Scott A. Cabelli, Rockwell Scientific Co. L.L.C. (United States)
Markus Loose, Rockwell Scientific Co. L.L.C. (United States)
Atul B. Joshi, Rockwell Scientific Co. L.L.C. (United States)
Gary W. Hughes, Rockwell Scientific Co. L.L.C. (United States)
Lester J. Kozlowski, Rockwell Scientific Co. L.L.C. (United States)
Allan K. Haas, Rockwell Scientific Co. L.L.C. (United States)
Selmer S. Wong, Rockwell Scientific Co. L.L.C. (United States)
Majid Zandian, Rockwell Scientific Co. L.L.C. (United States)
Annie Chi-yi Chen, Rockwell Scientific Co. L.L.C. (United States)
John G. Pasko, Rockwell Scientific Co. L.L.C. (United States)
Mark C. Farris, Rockwell Scientific Co. L.L.C. (United States)
Craig A. Cabelli, Rockwell Scientific Co. L.L.C. (United States)
Donald E. Cooper, Rockwell Scientific Co. L.L.C. (United States)
Jose M. Arias, Rockwell Scientific Co. L.L.C. (United States)
Jagmohan Bajaj, Rockwell Scientific Co. L.L.C. (United States)
Kadri Vural, Rockwell Scientific Co. L.L.C. (United States)


Published in SPIE Proceedings Vol. 4721:
Infrared Detectors and Focal Plane Arrays VII
Eustace L. Dereniak; Robert E. Sampson, Editor(s)

© SPIE. Terms of Use
Back to Top