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Proceedings Paper

Advanced FPAs for multiple applications
Author(s): Leonard P. Chen
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Paper Abstract

The advantages and uses of infrared (IR) imaging continue to grow. As such, a new generation of requirements for IR focal plane arrays (IRFPAs) has emerged that affects the development of both the detectors and readout integrated circuits (ROICs). Because these applications have varying requirements, a universal set of FPAs cannot be made to satisfy all needs, and custom designs are needed. However, the desired capabilities follow a common theme. The industry is receiving more demands in the areas of larger formats, increased sensitivity, smaller pixels, and higher functionality. These must be met in addition to achieving production quantities at a low cost. This paper focuses on two main facets of the complex FPA, the detector and readout integrated circuit (ROIC), to address the evolving requirements. For detectors, we explore both the cooled and uncooled technologies, where HgCdTe grown by molecular beam epitaxy (MBE) and vanadium oxide (VOx) microbolometers are discussed, respectively, for the two areas. Development in ROICs expands in terms of smart features, on-chip signal processing, and on-chip analog-to-digital conversion.

Paper Details

Date Published: 5 August 2002
PDF: 15 pages
Proc. SPIE 4721, Infrared Detectors and Focal Plane Arrays VII, (5 August 2002); doi: 10.1117/12.478834
Show Author Affiliations
Leonard P. Chen, Raytheon Infrared Operations (United States)


Published in SPIE Proceedings Vol. 4721:
Infrared Detectors and Focal Plane Arrays VII
Eustace L. Dereniak; Robert E. Sampson, Editor(s)

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