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Proceedings Paper

Laser cleaning in the process of electronic device production
Author(s): Ion G. Apostol; Dumitru Gh. Ulieru; Razvan V. Dabu; Constantin Ungureanu; L. Rusen
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Paper Abstract

Due to the continuous technological development in microelectronics and generally in precise materials micromachining there is a continuous need to develop more effective techniques to clean impurities from the surface. Current cleaning techniques used in microelectric devices fabrication lines have an integrated action on the whole surface or on a great part of it, are polluting the ambient and are not efficient for submicron particles. Due to this needs we have studied laser cleaning of silicon wafers with regards to direct applications in semiconductor manufacturing. We have analyzed the ablation effect of laser radiation of 1.06 micrometers on different materials currently used in microelectronic industry and the cleaning effect on a silicon support.

Paper Details

Date Published: 9 August 2002
PDF: 4 pages
Proc. SPIE 4762, ALT'01 International Conference on Advanced Laser Technologies, (9 August 2002); doi: 10.1117/12.478642
Show Author Affiliations
Ion G. Apostol, National Institute for Laser, Plasma, and Radiation Physics (Romania)
Dumitru Gh. Ulieru, Romanian Electronic Modules and Semiconductors SA (Romania)
Razvan V. Dabu, National Institute for Laser, Plasma, and Radiation Physics (Romania)
Constantin Ungureanu, National Institute for Laser, Plasma, and Radiation Physics (Romania)
L. Rusen, National Institute for Laser, Plasma, and Radiation Physics (Romania)


Published in SPIE Proceedings Vol. 4762:
ALT'01 International Conference on Advanced Laser Technologies

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