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Proceedings Paper

Ultrashort laser pulse processing of wave guides for medical applications
Author(s): David Ashkenasi; Arkadi Rosenfeld; Stefan B. Spaniol; Albert Terenji
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Paper Abstract

The availability of ultra short (ps and sub-ps) pulsed lasers has stimulated a growing interest in exploiting the enhanced flexibility of femtosecond and/or picosecond laser technology for micro-machining. The high peak powers available at relatively low single pulse energies potentially allow for a precise localization of photon energy, either on the surface or inside (transparent) materials. Three dimensional micro structuring of bulk transparent media without any sign of mechanical cracking has been demonstrated. In this study, the potential of ultra short laser processing was used to modify the cladding-core interface in normal fused silica wave guides. The idea behind this technique is to enforce a local mismatch for total reflection at the interface at minimal mechanic stress. The laser-induced modifications were studied in dependence of pulse width, focal alignment, single pulse energy and pulse overlap. Micro traces with a thickness between 3 and 8 μm were generated with a spacing of 10 μm in the sub-surface region using sub-ps and ps laser pulses at a wavelength of 800 nm. The optical leakage enforced by a micro spiral pattern is significant and can be utilized for medical applications or potentially also for telecommunications and fiber laser technology.

Paper Details

Date Published: 19 June 2003
PDF: 8 pages
Proc. SPIE 4978, Commercial and Biomedical Applications of Ultrafast Lasers III, (19 June 2003); doi: 10.1117/12.478583
Show Author Affiliations
David Ashkenasi, Laser-und Medizin-Technologie GmbH (Germany)
Arkadi Rosenfeld, Max-Born-Institut für Nichtlineare Optik (Germany)
Stefan B. Spaniol, CeramOptec GmbH (Germany)
Albert Terenji, CeramOptec GmbH (Germany)


Published in SPIE Proceedings Vol. 4978:
Commercial and Biomedical Applications of Ultrafast Lasers III
Joseph Neev; Andreas Ostendorf; Christopher B. Schaffer, Editor(s)

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