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Proceedings Paper

Modular process for integrating thick polysilicon MEMS devices with submicron CMOS
Author(s): John A. Yasaitis; Michael Judy; Tim Brosnihan; Peter M. Garone; Nikolay Pokrovskiy; Debbie Sniderman; Scott Limb; Roger T. Howe; Bernhard E. Boser; Moorthi Palaniapan; Xuesong Jiang; Sunil Bhave
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Paper Abstract

A new MEMS process module, called Mod MEMS, has been developed to monolithically integrate thick (5-10um), multilayer polysilicon MEMS structures with sub-micron CMOS. This process is particularly useful for advanced inertial MEMS products such as automotive airbag accelerometers where reduced cost and increased functionality is required, or low cost, high performance gyroscopes where thick polysilicon (>6um) and CMOS integration is required to increase poly mass and stiffness, and reduce electrical parasitics in order to optimize angular rate sensing. In this paper we will describe the new modular process flow, development of the critical unit process steps, integration of the module with a foundry sub-micron CMOS process, and provide test data on several inertial designs fabricated with this process.

Paper Details

Date Published: 15 January 2003
PDF: 10 pages
Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); doi: 10.1117/12.478294
Show Author Affiliations
John A. Yasaitis, Analog Devices, Inc. (United States)
Michael Judy, Analog Devices, Inc. (United States)
Tim Brosnihan, Analog Devices, Inc. (United States)
Peter M. Garone, Analog Devices, Inc. (United States)
Nikolay Pokrovskiy, Analog Devices, Inc. (United States)
Debbie Sniderman, Analog Devices, Inc. (United States)
Scott Limb, Palo Alto Research Ctr. (United States)
Roger T. Howe, Univ. of California/Berkeley (United States)
Bernhard E. Boser, Univ. of California/Berkeley (United States)
Moorthi Palaniapan, Univ. of California/Berkeley (United States)
Xuesong Jiang, Univ. of California/Berkeley (United States)
Sunil Bhave, Univ. of California/Berkeley (United States)

Published in SPIE Proceedings Vol. 4979:
Micromachining and Microfabrication Process Technology VIII
John A. Yasaitis; Mary Ann Perez-Maher; Jean Michel Karam, Editor(s)

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