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Proceedings Paper

Design and characterization of micro-inertia switches fabricated using low-temperature metal-electroplating technology
Author(s): Wei Ma; Yitshak Zohar; Man Wong
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Paper Abstract

Inertia micro-switches have been designed and realized using a low-temperature metal-electroplating technology compatible with processed substrates containing micro-electronic circuits. A simple but accurate lumped spring-mass model is developed based on analytical and numerical analyses. Predictions of the behavior of switches with different geometric designs have been verified using both drop hammer and shaker tests. With the application of an anti-stiction hydrophobic coating, improved storage time and un-encapsulated switches making over 50 million contacts have been demonstrated in room ambient.

Paper Details

Date Published: 16 January 2003
PDF: 8 pages
Proc. SPIE 4981, MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication II, (16 January 2003); doi: 10.1117/12.478285
Show Author Affiliations
Wei Ma, Hong Kong Univ. of Science and Technology (China)
Yitshak Zohar, Hong Kong Univ. of Science and Technology (China)
Man Wong, Hong Kong Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 4981:
MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication II
Siegfried W. Janson, Editor(s)

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