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Proceedings Paper

Processable high-carbon-yielding polymer for micro- and nanofabrication
Author(s): Mark W. Perpall; Huseyin Zengin; K. Prasanna U. Perera; Wensheng Zhou; Hiren Shah; Xinyu Wu; Stephen E Creager; Dennis W. Smith; Stephen H. Foulger; John M. Ballato
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Paper Abstract

Bis-ortho-Diynyl Arene (BODA) monomers polymerize to network polynapthalene by the thermally-driven Bergman cyclization and subsequent radical polymerization via oligomeric intermediates that can be melt or solution processed. Further heating of the network to 1000 °C affords a high-yield glassy carbon structure that retains the approximate size and dimensions of the polymer precursor. The higher carbon-yield for BODA networks (75- 80 % by mass) is significantly greater than that of traditional phenol-formaldehyde resins and other carbon precursor polymers leading to its greater dimensional stability. Phenyl terminated BODA derived polymers were fabricated using microprocessing such as the micromolding in capillaries (MIMIC) technique, direct microtransfer molding, and molding in quartz capillary tubes. Nano-scale fabrication using closed packed silica spheres as templates was demonstrated with an hydroxy-terminated monomer which exhibits greatly enhanced compatibility for silica surfaces. After pyrolysis to glassy carbon, the silica is chemically etched leaving an inverse carbon opal photonic crystal which is electrically conductive. The wavelength of light diffracted is a function of the average refractive index of the carbon/ filler composite, which can be modified for use as sensitive detector elements.

Paper Details

Date Published: 15 January 2003
PDF: 10 pages
Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); doi: 10.1117/12.478252
Show Author Affiliations
Mark W. Perpall, Clemson Univ. (United States)
Huseyin Zengin, Clemson Univ. (United States)
K. Prasanna U. Perera, Clemson Univ. (United States)
Wensheng Zhou, Clemson Univ. (United States)
Hiren Shah, Clemson Univ. (United States)
Xinyu Wu, Clemson Univ. (United States)
Stephen E Creager, Clemson Univ. (United States)
Dennis W. Smith, Clemson Univ. (United States)
Stephen H. Foulger, Clemson Univ. (United States)
John M. Ballato, Clemson Univ. (United States)


Published in SPIE Proceedings Vol. 4979:
Micromachining and Microfabrication Process Technology VIII
John A. Yasaitis; Mary Ann Perez-Maher; Jean Michel Karam, Editor(s)

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