Share Email Print

Proceedings Paper

Novel micromolded structures
Author(s): James G. Fleming; Seethambal S. Mani; Michael S. Baker
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Current deep trench etch systems are able to etch two micron wide features ten’s of microns deep into a silicon substrate. Conformal chemical vapor deposition (CVD) processes are readily able to fill the trenches with reasonable deposition thickness by growing from the sidewalls in. We have used this approach to demonstrate 30 micron thick tungsten structural members integrated with 30 micron thick silicon nitride electrical isolation. The moving tungsten and silicon nitride structures are suspended 15 microns off the surface of the substrate by silicon nitride posts. Planarity is maintained throughout the process.

Paper Details

Date Published: 15 January 2003
PDF: 8 pages
Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); doi: 10.1117/12.478243
Show Author Affiliations
James G. Fleming, Sandia National Labs. (United States)
Seethambal S. Mani, Sandia National Labs. (United States)
Michael S. Baker, Sandia National Labs. (United States)

Published in SPIE Proceedings Vol. 4979:
Micromachining and Microfabrication Process Technology VIII
John A. Yasaitis; Mary Ann Perez-Maher; Jean Michel Karam, Editor(s)

© SPIE. Terms of Use
Back to Top