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Proceedings Paper

MEMS production and yield improvement using a flux-free/void-free assembly process
Author(s): Gary Pangelina
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Paper Abstract

Microelectromechanical systems (MEMS) promise to revolutionize nearly every product category by bringing together silicon-based microelectronics with micromachining technology, thereby, making possible the realization of a complete system on a chip. As the MEMS application approaches the different market places cost, performance, hermeticity, and reliability become the key issues. Flux free/void-free soldering is accomplished by controlling the atmosphere, time, and temperature. This is a simplified version of the Pressure Variation method. P1 V1 = P2 V2, V2 = V1 (P1/ P2). The hermeticity level of the package can directly affect MEMS device performance. Hermeticity level of 10-8 and sometimes 109 are common measurements. Getter firing as part of the package seal process means higher yields, total control of the internal atmosphere of the package, improved quality and reliability. Getter pumps are based on those elements in the periodic table with features that make them suitable to act as a vacuum pump. Quality control standards for MEMS technologies are needed. Part of the problem is that the technology is so new and ever changing that the fabricators do not yet know how to define quality, much less measure it.

Paper Details

Date Published: 16 January 2003
PDF: 7 pages
Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); doi: 10.1117/12.478205
Show Author Affiliations
Gary Pangelina, SST International (United States)

Published in SPIE Proceedings Vol. 4980:
Reliability, Testing, and Characterization of MEMS/MOEMS II
Rajeshuni Ramesham; Danelle M. Tanner, Editor(s)

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