Share Email Print

Proceedings Paper

Solder bonding for microelectromechanical systems (MEMS) applications
Author(s): Abhijat Goyal; Srinivas Tadigadapa; Rafiqul Islam
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

MEMS fabrication and packaging requires a bonding technology that is universal for all substrates, has high resolution, requires relatively lower temperatures, is reliable and is low cost to implement. The bonding technology presented meets the above standards. The process is substrate independent and involves aligned bonding of two similarly patterned wafers using tin solder as the bonding material. The technique can be used for whole wafer or selected area bonding. The resolution of this technique is only limited by the resolution that can be achieved in the patterning and delineation of the seed metal.

Paper Details

Date Published: 16 January 2003
PDF: 8 pages
Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); doi: 10.1117/12.478202
Show Author Affiliations
Abhijat Goyal, The Pennsylvania State Univ. (United States)
Srinivas Tadigadapa, The Pennsylvania State Univ. (United States)
Rafiqul Islam, EV Group Inc. (United States)

Published in SPIE Proceedings Vol. 4980:
Reliability, Testing, and Characterization of MEMS/MOEMS II
Rajeshuni Ramesham; Danelle M. Tanner, Editor(s)

© SPIE. Terms of Use
Back to Top