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Proceedings Paper

Temperature effects on microstructural evolution and resulting surface mechanical properties of Ni-based MEMS structures
Author(s): Kun Lian; Jiechao Jiang; Zhong Geng Ling; Efstathios I. Meletis
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Paper Abstract

This paper presents recent results on the microstructural evolution and the resulting mechanical property changes as a function of elevated temperature exposure of two types of electroplated nanocrystalline LIGA Ni. Electroplated Ni structures are the main candidates for LIGA-based MicroElectroMechanical System (MEMS). Initial studies have been conducted to correlate microstructure of electroplated Ni and resulting mechanical properties. A major drawback is that upon exposure to elevated temperatures, electroplated Ni MEMS components suffer dramatic reductions in strength mainly due to grain coarsening. This kind of strength deterioration at elevated temperatures can be detrimental to many MEMS applications, especially to micro-engines and molding inserts. Thus, in order to improve the high temperature performance of LIGA Ni, knowledge of the underlying mechanism is needed. At present, there is very limited understanding of processing-microstructure-property relationship for LIGA Ni at both room and elevated temperatures. The current research is focused on temperature effects on the microstructure of LIGA Ni and the resulting mechanical properties. Two types of sulfuric acid-based solutions were used to produce electroplated Ni samples with different microstructural characteristics. The DSC technique was used to study the stability of plated Ni at elevated temperatures. Transmission electron microscopy (TEM) and scanning electron microscopy (SEM) were used to examine the microstructural changes of plated Ni samples as a function of annealing temperature. Nanoindentation tests were performed to study the effects of the evolved microstructures on mechanical properties. The underlying mechanism correlating microstructure and mechanical properties of LIGA Ni at elevated temperatures is discussed.

Paper Details

Date Published: 16 January 2003
PDF: 8 pages
Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); doi: 10.1117/12.478193
Show Author Affiliations
Kun Lian, Louisiana State Univ. (United States)
Jiechao Jiang, Louisiana State Univ. (United States)
Zhong Geng Ling, Louisiana State Univ. (United States)
Efstathios I. Meletis, Louisiana State Univ. (United States)


Published in SPIE Proceedings Vol. 4980:
Reliability, Testing, and Characterization of MEMS/MOEMS II
Rajeshuni Ramesham; Danelle M. Tanner, Editor(s)

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