Share Email Print

Proceedings Paper

System on chip approach for a SIMD architecture dedicated to 2D and 3D image processing
Author(s): Julien Denoulet; Didier Dulac
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The Associative Mesh, a reconfigurable, asynchronous and massively parallel SIMD architecture, is a hardware transposition of the Associative Nets model, where each entity, to achieve maximal efficiency, is supposed to stand for one pixel of an image. Global operations in the circuit are performed using an asynchronous electronic. This implementation allows for a very fast computation time - about a microsecond - and with a crossing time of each processor of about a nanosecond. Asynchronism also allows the design to save area, power and reach a higher clock frequency. Most of the image analysis algorithns for 2D or 3D set of datas can be implemented using the Associative Mesh. Our objective is to implement a full-size Associative Mesh with a SoC aim. To achieve this, we have studied the contribution of processors' virtualisation. We show that, provided a reorganisation of the synchronous part of the circuit, it offers a significant area gain which increases with the degree of virtualisation (reaching 20% for a degree equal to 16). We also discuss how virtualisation preserves the architecture's performances, and is useful to adapt the circuit to 3D treatments. Algorithm evaluations show that this architecture is compatible with real-time 2D and 3D image processing.

Paper Details

Date Published: 14 April 2003
PDF: 10 pages
Proc. SPIE 5012, Real-Time Imaging VII, (14 April 2003); doi: 10.1117/12.477494
Show Author Affiliations
Julien Denoulet, Groupe ESIEE (France)
Univ. Paris-Sud 11 (France)
Didier Dulac, Groupe ESIEE (France)

Published in SPIE Proceedings Vol. 5012:
Real-Time Imaging VII
Nasser Kehtarnavaz; Phillip A. Laplante, Editor(s)

© SPIE. Terms of Use
Back to Top