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Proceedings Paper

Silicon-on-silicon microsystem in plastic packages
Author(s): Agneta Novak; Anders Glaes; Claes Blom; Hans Hentzell; Charles Hodges; Farzeen Kalhur
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Paper Details

Date Published: 1 April 1991
PDF: 7 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.47720
Show Author Affiliations
Agneta Novak, Univ. of Linkoping (Sweden)
Anders Glaes, Univ. of Linkoping (Sweden)
Claes Blom, Univ. of Linkoping (Sweden)
Hans Hentzell, Univ. of Linkoping (Sweden)
Charles Hodges, Univ. of Linkoping (Sweden)
Farzeen Kalhur, AMKOR/ANAM Europe Ltd. (United Kingdom)


Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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