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Proceedings Paper

Flexible mask specifications
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Paper Abstract

A methodology for specifying mask quality named flexible mask specifications is proposed. The methodology consists of two major concepts. One is flexibly selected patterns to guarantee mask quality for each device and each level of devices using full-chip level lithography simulation. The other is flexibly changeable combination of each tolerance for each error component. The validity of flexible mask specifications is proved on masks of a 130nm node memory device. Using the flexible mask specifications, we have confirmed that mask manufacturing yield rise up by 20 percent on masks of a 175nm node memory device compared with the yield of the masks judged by conventional mask specifications.

Paper Details

Date Published: 1 August 2002
PDF: 10 pages
Proc. SPIE 4754, Photomask and Next-Generation Lithography Mask Technology IX, (1 August 2002); doi: 10.1117/12.477004
Show Author Affiliations
Shigeki Nojima, Toshiba Corp. (Japan)
Shoji Mimotogi, Toshiba Corp. (Japan)
Masamitsu Itoh, Toshiba Corp. (Japan)
Osamu Ikenaga, Toshiba Corp. (Japan)
Shigeru Hasebe, Toshiba Corp. (Japan)
Kohji Hashimoto, Toshiba Corp. (Japan)
Soichi Inoue, Toshiba Corp. (Japan)
Mineo Goto, Toshiba Corp. (Japan)
Ichiro Mori, Toshiba Corp. (Japan)


Published in SPIE Proceedings Vol. 4754:
Photomask and Next-Generation Lithography Mask Technology IX
Hiroichi Kawahira, Editor(s)

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