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Proceedings Paper

Simulation based defect printability analysis on attenuated phase-shifting masks
Author(s): Linyong Pang; Qi-De Qian; Kevin K. Chan; Nobuhito Toyama; Naoya Hayashi
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Paper Abstract

Simulated wafer images for Attenuated Phase Shift Mask (ATTPSM) features are performed by the Virtual Stepper System. The ATTPSM test reticles were prepared with programmed defects (hard defects and phase defects) on line/space patterns, contact hole patterns, and rectangle patterns for 150-nm design rules. Each defect area was inspected using KLA-Tencor's UV-HR365 and SLF27 inspection systems. Virtual Stepper simulations are compared with Aerial Image Measurement System (AIMSTM) simulation at best focus and at multiple defocus levels. In addition, simulation accuracy from different inspection images is compared.

Paper Details

Date Published: 1 August 2002
PDF: 8 pages
Proc. SPIE 4754, Photomask and Next-Generation Lithography Mask Technology IX, (1 August 2002); doi: 10.1117/12.476979
Show Author Affiliations
Linyong Pang, Numerical Technologies, Inc. (United States)
Qi-De Qian, Numerical Technologies, Inc. (United States)
Kevin K. Chan, Numerical Technologies, Inc. (United States)
Nobuhito Toyama, Dai Nippon Printing Co., Ltd. (Japan)
Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 4754:
Photomask and Next-Generation Lithography Mask Technology IX
Hiroichi Kawahira, Editor(s)

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