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Proceedings Paper

Comparison and correlation of VSS simulation results using images from different inspection systems
Author(s): Kevin Hung; Denis Lin; Rex L. Chou; Samuel C. Yang; Don Lee; Alex Tseng; Hiromasa Unno; Jiunn-Hung Chen; Jason H. Huang
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Paper Abstract

As photolithography is moving forwards to finer resolution, mask-making requirements also becomes much more stringent than before so as to compensate the gradually compressed process window on wafer. IN addition to requiring tighter CD specification , the defect disposition on mask is the most controversial issue needed to address by mask makers. As everybody knows, the defect problems are always the argument points after shipping between mask houses and wafer fabs. And the defect specifications defined by defect size are also no longer effective under complex environments of aggressive OPC features. To face the challenge under this environment many mask makers and mask users are turning to simulation-based photomask qualification. Comparing with hardware-based AIMS measurement, Virtual Stepper System (VSS) easy operation and flexibility become more attractive for users. How to apply the VSS into the production line becomes an emerging issue for mask makers and mask users. In general, mask-houses to keep the production line having satisfied inspection capability and cost-efficient. Although VSS can be completely connected with the sate-of-the-art tools from different companies, the simulation accuracy still needs to be evaluated to unify the criterion of defect judgement. Because VSS makes the simulation according to the captured mask image, the simulation results are strongly dependent on the quality of the providing images. Mix-and- match verification on VSS simulation between different inspection systems has been done in this study to give a reasonable criterion for simulation-based photomask qualification.

Paper Details

Date Published: 1 August 2002
PDF: 7 pages
Proc. SPIE 4754, Photomask and Next-Generation Lithography Mask Technology IX, (1 August 2002); doi: 10.1117/12.476967
Show Author Affiliations
Kevin Hung, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Denis Lin, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Rex L. Chou, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Samuel C. Yang, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Don Lee, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Alex Tseng, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Hiromasa Unno, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Jiunn-Hung Chen, Numerical Technologies, Inc. (United States)
Jason H. Huang, Numerical Technologies, Inc. (United States)

Published in SPIE Proceedings Vol. 4754:
Photomask and Next-Generation Lithography Mask Technology IX
Hiroichi Kawahira, Editor(s)

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