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Proceedings Paper

CD variations from nontrivial mask-related factors
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Paper Abstract

Mask critical dimension (CD) control relies on advanced write tools and resist processes. However, a specified write tool and process does not necessarily guarantee high mask quality. As the mask feature size shrinks to below 500 nm, there are other mask-related factors that can also significantly affect the mask performance. This paper discusses the impact of those non-trivial factors, such as mask writing tool and process control, calibration of mask CD metrology, blank quality of attenuated phase shift mask (ATPSM), pellicle degradation due to 193 nm laser irradiation, and profile of mask features, etc.

Paper Details

Date Published: 1 August 2002
PDF: 7 pages
Proc. SPIE 4754, Photomask and Next-Generation Lithography Mask Technology IX, (1 August 2002); doi: 10.1117/12.476928
Show Author Affiliations
Z. Mark Ma, Texas Instruments Inc. (United States)
Won D. Kim, Texas Instruments Inc. (United States)
Benjamen M. Rathsack, Texas Instruments Inc. (United States)
Guoqiang Xing, Texas Instruments Inc. (United States)
Mark H. Somervell, Texas Instruments Inc. (United States)
Hyesook Hong, Texas Instruments Inc. (United States)


Published in SPIE Proceedings Vol. 4754:
Photomask and Next-Generation Lithography Mask Technology IX
Hiroichi Kawahira, Editor(s)

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