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Proceedings Paper

3D self-aligned microassembled electrical interconnects for heterogeneous integration
Author(s): Trent Huang; Erik Nilsen; Matt Ellis; Kabseog Kim; Ken Tsui; George D. Skidmore; Chuck Goldsmith; Arunkumar Nallani; Jeong-Bong Lee
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Paper Abstract

It is of great interest to develop an efficient and reliable manufacturing approach that allows for the integration of microdevices each of which is optimally fabricated using a different process. We present a new method to achieve electrical and mechanical interconnects for use in heterogeneous integration. This method combines metal reflow and a self-aligned, 3-D microassembly approach. The results obtained so far include a self-aligned, 3-D assembly of MEMS to MEMS, post-processing which selectively deposited indium on 50 μm-thick MEMS structures, and reflow tests of indium-on-gold samples demonstrating 15-45 mΩ resistances for contact areas ranging from 100 to 625 μm2. 3-D microassembly coupled with metal reflow allows for the batch processing of a large number of heterogeneous devices into one system without sacrificing performance. In addition, its 3-D nature adds a new degree of freedom in system design space. Downward scalability of the method is also discussed.

Paper Details

Date Published: 16 January 2003
PDF: 13 pages
Proc. SPIE 4981, MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication II, (16 January 2003); doi: 10.1117/12.476319
Show Author Affiliations
Trent Huang, Zyvex Corp. (United States)
Erik Nilsen, Zyvex Corp. (United States)
Matt Ellis, Zyvex Corp. (United States)
Kabseog Kim, Zyvex Corp. (United States)
Ken Tsui, Zyvex Corp. (United States)
George D. Skidmore, Zyvex Corp. (United States)
Chuck Goldsmith, MEMtronics Corp. (United States)
Arunkumar Nallani, Univ. of Texas/Dallas (United States)
Jeong-Bong Lee, Univ. of Texas/Dallas (United States)


Published in SPIE Proceedings Vol. 4981:
MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication II
Siegfried W. Janson, Editor(s)

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