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Proceedings Paper

Microshutter arrays for near-infrared applications on the James Webb Space Telescope
Author(s): Mary J. Li; Alex Bier; Rainer K. Fettig; David E. Franz; R. Hu; T. King; Alexander S. Kutyrev; Bernard A. Lynch; Samuel Harvey Moseley; David Brent Mott; David A. Rapchun; Robert F. Silverberg; Wayne Smith; L. Wang; Yun Zheng; C. Zinke
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Paper Abstract

Magnetically actuated MEMS microshutter arrays are being developed at the NASA Goddard Space Flight Center for use in a multi-object spectrometer on the James Webb Space Telescope (JWST), formerly Next Generation Space Telescope (NGST). The microshutter arrays are designed for the selective transmission of light with high efficiency and high contrast. The JWST environment requires cryogenic operation at 45K. Microshutter arrays are fabricated out of silicon-on-insulator (SOI) wafers. Arrays consist of close-packed shutters made on silicon nitride (nitride) membranes with a pixel size of 100 × 100 m. Individual shutters are patterned with a torsion flexure permitting shutters to open 90°, with a minimized mechanical stress concentration. Shutters operated this way have survived fatigue life test. The mechanical shutter arrays are fabricated using MEMS technologies. The processing includes a multi-layer metal deposition, patterning of shutter electrodes and magnetic pads, reactive ion etching (RIE) of the front side to form shutters in a nitride film, an anisotropic back-etch for wafer thinning, and a deep RIE (DRIE) back-etch, down to the nitride shutter layer, to form support frames and relieve shutters from the silicon substrate. An additional metal deposition and patterning has recently been developed to form electrodes on the vertical walls of the frame. Shutters are actuated using a magnetic force, and latched electrostatically. One-dimensional addressing has been demonstrated.

Paper Details

Date Published: 16 January 2003
PDF: 9 pages
Proc. SPIE 4981, MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication II, (16 January 2003); doi: 10.1117/12.476285
Show Author Affiliations
Mary J. Li, NASA Goddard Space Flight Ctr. (United States)
Alex Bier, NASA Goddard Space Flight Ctr. and Global Science and Technology, Inc. (United States)
Global Science and Technology, Inc. (United States)
Rainer K. Fettig, NASA Goddard Space Flight Ctr. and Raytheon ITTS (United States)
Raytheon Co./ITSS (United States)
David E. Franz, NASA Goodard Space Flight Ctr. and Raytheon ITTS (United States)
Raytheon Co./ITSS (United States)
R. Hu, Nasa Goddard Space Flight Ctr. and Raytheon ITTS (United States)
Raytheon Co./ITSS (United States)
T. King, NASA Goddard Space Flight Ctr. (United States)
Alexander S. Kutyrev, NASA Goddard Space Flight Ctr. and Raytheon ITTS (United States)
Raytheon Co./ITSS (United States)
Bernard A. Lynch, NASA Goddard Space Flight Ctr. and Raytheon ITTS (United States)
Raytheon Co./ITSS (United States)
Samuel Harvey Moseley, NASA Goddard Space Flight Ctr. (United States)
David Brent Mott, NASA Goddard Space Flight Ctr. (United States)
David A. Rapchun, NASA Goddard Space Flight Ctr. and Raytheon ITTS (United States)
Raytheon Co./ITSS (United States)
Robert F. Silverberg, NASA Goddard Space Flight Ctr. (United States)
Wayne Smith, NASA Goddard Space Flight Ctr. and Orbital Science Corp. ITTS (United States)
Orbital Sciences Corp. (United States)
L. Wang, NASA Goddard Space Flight Ctr. and Swales Aerospace Co. (United States)
Swales Aerospace, Inc. (United States)
Yun Zheng, NASA Goddard Space Flight Ctr. and QSS Group, Inc. (United States)
QSS Group, Inc. (United States)
C. Zinke, NASA Goddard Space Flight Ctr. and QSS Group, Inc. (United States)
QSS Group, Inc. (United States)


Published in SPIE Proceedings Vol. 4981:
MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication II
Siegfried W. Janson, Editor(s)

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