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Proceedings Paper

High-density interleaved VCSEL-RCPD arrays for optical information processing
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Paper Abstract

Vertical-cavity surface-emitting lasers (VCSELs) are uniquely suited for massively parallel interconnects and scannerless imaging applications due to their small size, high efficiency and amiability to formation of high-density 2-dimensional arrays. We have successfully fabricated 4096 element arrays (64×64) containing alternating rows of selectively-oxidized 850 nm VCSELs and resonant-cavity photodetectors (RCPDs) on a 55 micron pitch monolithically integrated on semi-insulating GaAs substrates. We employ a matrix addressable architecture to reduce the input and output electrical connections to the array, where all the VCSELs (or RCPDs) in each row are connected by a common metal trace at the base of their mesas. The columns are connected by metal traces that bridge from mesa top to mesa top, connecting every other row (i.e., only VCSELs or only RCPDs). The design, fabrication and performance of these arrays is discussed.

Paper Details

Date Published: 15 April 2003
PDF: 6 pages
Proc. SPIE 4942, VCSELs and Optical Interconnects, (15 April 2003); doi: 10.1117/12.476226
Show Author Affiliations
Kent M. Geib, Sandia National Labs. (United States)
Darwin K. Serkland, Sandia National Labs. (United States)
Andrew A. Allerman, Sandia National Labs. (United States)
Terry W. Hargett, Sandia National Labs. (United States)
Kent D. Choquette, Univ. of Illinois/Urbana-Champaign (United States)


Published in SPIE Proceedings Vol. 4942:
VCSELs and Optical Interconnects
Hugo Thienpont; Jan Danckaert, Editor(s)

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