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Proceedings Paper

New technique for the manipulation of nanostructured metal-oxide properties
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Paper Abstract

Nanocomposite materials have attracted considerable research effort in recent years both because of their potential technological applications and because of their relevance to the study of basic physical properties in this range of sizes. On decreasing the dimensions of a material to the nanometre scale, many new effects appear, such as quantum size effects, which can result in new physical properties so that nanostructured materials can show novel optical, electrical, magnetic and catalytic properties that are different from those of bulk materials. The electrical conductivity is also related to the grain size and separation and the gas sensing properties. Many techniques can be employed to fabricate nanocomposite films, such as sol-gel, sputtering and ion implantation. In this work we have deposited mixed oxide of Mo-W, Ti-W and Mo-Ti by sputtering. The production of chemoresistive semiconducting films through selective sublimation processing Ti-W-O, Mo-W-O has been obtained and furthermore the manipulation of a metal-oxide properties by doping Mo:TiO2 and Ti:MoO3. This technique consists of deposition of a mixed-oxide layer, the annealing of the film leads to depletion of the phase with lowest sublimation temperature. The method allows the achievement of films ideal for gas sensing via chemoresistive effect: grain-coalescence inhibition, i.e., nanostructured materials, porous films and modifiable composition. The gas sensing properties of these materials toward gases like CO, NO2 and ethanol have been studied.

Paper Details

Date Published: 13 November 2002
PDF: 9 pages
Proc. SPIE 4936, Nano- and Microtechnology: Materials, Processes, Packaging, and Systems, (13 November 2002); doi: 10.1117/12.476089
Show Author Affiliations
Elisabetta Comini, INFM (Italy)
Univ. of Brescia (Italy)
Giorgio Sberveglieri, INFM (Italy)
Univ. of Brescia (Italy)

Published in SPIE Proceedings Vol. 4936:
Nano- and Microtechnology: Materials, Processes, Packaging, and Systems
Dinesh K. Sood; Ajay P. Malshe; Ryutaro Maeda, Editor(s)

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