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Proceedings Paper

Development of a sub-100nm integrated imaging system using chromeless phase-shifting imaging with very high NA KrF exposure and off-axis illumination
Author(s): John S. Petersen; Will Conley; Bernard J. Roman; Lloyd C. Litt; Kevin Lucas; Wei Wu; Douglas J. Van Den Broeke; J. Fung Chen; Thomas L. Laidig; Kurt E. Wampler; David J. Gerold; Mark John Maslow; Robert John Socha; Judith van Praagh; Richard Droste
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Paper Abstract

Examining features of varying pitch imaged using phase- shifting masks shows a pitch dependence eon the transmission best suited for optimum imaging. The reason for this deals with the relative magnitude of the zero and higher diffraction orders that are formed as the exposing wavelength passes through the plurality of zero and higher diffraction orders that are formed as the exposing wavelength passes through the plurality of zero and 180- degree phase-shifted regions. Subsequently, some of the diffraction orders are collected and projected to form the image of the object. chromeless Phase-Shift Lithography (CPL) deals with using half-toning structures to manipulate these relative magnitudes of these diffraction orders to ultimately construct the desired projected image. A key feature of CPL is that with the ability to manipulate the diffraction orders, a single weak phase-shifting mask can be made to emulate any weak phase-shifting mask and therefore the optimal imaging condition of any pattern can be placed on a single mask regardless of the type of weak phase- shifter that produces that result. In addition, these structures are used to render the plurality of size, shape and pitch such that the formed images produce their respective desired size and shape with sufficient image process tolerance. These images are typically made under identical exposure conditions, but not limited to single exposure condition. These half toning structures can be used exterior, as assist features, or interior to the primary feature. These structures can range in transmission from 0 percent to 100 percent and they can be phase-shifted relative to the primary features or not. Thus CPL deals with the design, layout, and utilization of transparent and semi- transparent phase-shift masks and their use in an integrated imaging solution of exposure tool, mask and the photoresist recording media. This paper describes the method of diffraction matching, provides an example and reviews some experimental data using high numerical aperture KrF exposure.

Paper Details

Date Published: 12 July 2002
PDF: 14 pages
Proc. SPIE 4692, Design, Process Integration, and Characterization for Microelectronics, (12 July 2002); doi: 10.1117/12.475692
Show Author Affiliations
John S. Petersen, Petersen Advanced Lithography, Inc. (United States)
Will Conley, Motorola (United States)
Bernard J. Roman, Motorola (United States)
Lloyd C. Litt, Motorola (United States)
Kevin Lucas, Motorola (United States)
Wei Wu, Motorola (United States)
Douglas J. Van Den Broeke, ASML Masktools, Inc. (United States)
J. Fung Chen, ASML Masktools, Inc. (United States)
Thomas L. Laidig, ASML Masktools, Inc. (United States)
Kurt E. Wampler, ASML Masktools, Inc. (United States)
David J. Gerold, Petersen Advanced Lithography, Inc. (United States)
Mark John Maslow, Petersen Advanced Lithography, Inc. (United States)
Robert John Socha, ASML TDC (United States)
Judith van Praagh, ASML (Netherlands)
Richard Droste, ASML (Netherlands)

Published in SPIE Proceedings Vol. 4692:
Design, Process Integration, and Characterization for Microelectronics
Alexander Starikov; Alexander Starikov; Kenneth W. Tobin, Editor(s)

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