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Proceedings Paper

New method for reducing across-chip poly-CD variation with statistical OPC/gauge capability analysis
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Paper Abstract

In this paper, we propose a new analysis method to quantify the performance of optical proximity effect correction (OPC) as well as the gauge capability of in-process quality control (IPQC) monitors. The method consists of two stages. The first stage is to quantify the gauge capability of IPQC monitor patters for representing 'across chip line width variation' (ACLV). The second one is to verify OPC by using the IPQC monitor patterns as verified in the first stage. Our new analysis method has bene found to be remarkably effective and quite useful to optimize OPC parameters and other methods in attempting to reduce ACLV, the most critical factor in producing high-end logic devices with a design rule of 0.15 micrometers and below.

Paper Details

Date Published: 12 July 2002
PDF: 9 pages
Proc. SPIE 4692, Design, Process Integration, and Characterization for Microelectronics, (12 July 2002); doi: 10.1117/12.475672
Show Author Affiliations
Hidetoshi Ohnuma, Sony Corp. (Japan)
Koji Kikuchi, Sony Corp. (Japan)
Hiroichi Kawahira, Sony Corp. (Japan)


Published in SPIE Proceedings Vol. 4692:
Design, Process Integration, and Characterization for Microelectronics
Alexander Starikov; Kenneth W. Tobin; Alexander Starikov, Editor(s)

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