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Proceedings Paper

Nondestructive testing of damage layers in semiconductor materials by surface acoustic waves
Author(s): Dieter Schneider; Eva Stiehl; Ralf Hammer; Andreas Franke; Richard P. Riegert; Thomas Schuelke
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Paper Abstract

Slicing semi-conductor wafers form ingots produces a damage layer that ha to be completely removed by complex polishing and etching processes. Nondestructively controlling the machining process is desirable. Laser induced surface acoustic waves are demonstrated to be a promising method to characterize the state of the surface.

Paper Details

Date Published: 12 July 2002
PDF: 17 pages
Proc. SPIE 4692, Design, Process Integration, and Characterization for Microelectronics, (12 July 2002); doi: 10.1117/12.475660
Show Author Affiliations
Dieter Schneider, Fraunhofer Institute for Material and Beam Technology (Germany)
Eva Stiehl, Wacker Siltronic AG (Germany)
Ralf Hammer, Freiberger Compound Materials GmbH (Germany)
Andreas Franke, Technische Univ. Dresden (Germany)
Richard P. Riegert, Quad Associated Products, Inc. (United States)
Thomas Schuelke, Fraunhofer USA (United States)


Published in SPIE Proceedings Vol. 4692:
Design, Process Integration, and Characterization for Microelectronics
Alexander Starikov; Kenneth W. Tobin; Alexander Starikov, Editor(s)

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