Share Email Print

Proceedings Paper

Microloading characterization of 300-mm etch and CMP tools
Author(s): Karl E. Mautz
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

An investigation of the microloading effects form the 300mm wafer Etch and CMP polish processes was done at SC300, a joint venture between Motorola and Infineon Technologies for 300mm wafer, process and equipment development in Dresden, Germany. Test wafers were constructed to approximate the structural features of DRAM and microprocessors devices, and standard or scaled-up processes were run to identify potential limitations and defects. Oxide dielectric etch and CMP process instability and microloading effects are know n to cause significant device yield loss.

Paper Details

Date Published: 12 July 2002
PDF: 11 pages
Proc. SPIE 4692, Design, Process Integration, and Characterization for Microelectronics, (12 July 2002); doi: 10.1117/12.475653
Show Author Affiliations
Karl E. Mautz, Motorola (United States)

Published in SPIE Proceedings Vol. 4692:
Design, Process Integration, and Characterization for Microelectronics
Alexander Starikov; Alexander Starikov; Kenneth W. Tobin Jr., Editor(s)

© SPIE. Terms of Use
Back to Top