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Proceedings Paper

Automated residual metal inspection
Author(s): Rajesh Tiwari; Joel Strupp; Prasad S. Terala; Doron Shoham
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Paper Abstract

Residual metal inspection is an integral part of CMP manufacturing processes. This can be accomplished by adapting the existing YE inspection tools or microscopes. The use of Front Opening Unified Pod (FOUP) to house the wafers in 300 mm manufacturing offers unique challenges for wafer handling which necessitates the use of automated inspection procedures. These automated inspection procedures must not impede the flow of production material while achieving 100 percent inspection, and also have increased reliability compared to the existing inspection technologies. Ideally, these inspection procedures should be integrated into a feedback loop for further processing control. In this study, an existing particle monitoring technology for both bare and patterned wafers has been adapted for residual metal inspection. This is a new and unique application for post-metal CMP residue metal detection, which replaces the microscope visual inspection process. This technique uses a previously scanned 'golden wafer' to create the inspection recipe for a given pattern density and metal thickness, which is used to inspect other similarly processed product. This technique can be integrated to a CMP process tool, which can lead to significant reduction in cycle time and improved inspection efficiency.

Paper Details

Date Published: 12 July 2002
PDF: 9 pages
Proc. SPIE 4692, Design, Process Integration, and Characterization for Microelectronics, (12 July 2002); doi: 10.1117/12.475643
Show Author Affiliations
Rajesh Tiwari, Texas Instruments Inc. (United States)
Joel Strupp, Texas Instruments Inc. (United States)
Prasad S. Terala, Applied Materials (United States)
Doron Shoham, Applied Materials (United States)


Published in SPIE Proceedings Vol. 4692:
Design, Process Integration, and Characterization for Microelectronics
Alexander Starikov; Kenneth W. Tobin; Alexander Starikov, Editor(s)

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